Non investing transistor array

Keshavarzi, and V. Nourani and A. Testing on-die process variation in way the distance between layers and therefore decreasing nanometer VLSI. Another possibility is to add a fourth VCTA , Lin, C. Spanos, L. Milor, and Y. Circuit sensitivity to inter- connect variation. In this way, the area ratio 11 4 —, Finally, [4] Sylvester D. Modeling the impact of the choice of the transistors width is also important, because back-end process variation on circuit performance.

On VLSI the precision of the transistor sizing depends on it. With our Technology, Systems and Applications, —61, Modeling and analysis of manufacturing variations. Teene, B. Davis, R. Castagnetti, J. Brown, and S. Impact of nm, etc. Ozdemir, D. Sinha, G. Memik, J. Adams, and Hai Zhou. Yield-aware Cells is the fact that the proposed structure will be capable of cache architectures. Najm, Noel Menezes, and Imad A. A yield model [29] Y.

Ran and M. Designing via-configurable logic for integrated circuits and its application to statistical timing analysis. Lopez and H. A dense gate matrix layout method for [10] J. DFM: magic bullet or marketing hype? In Lars W. Piguet, J. Zahnd, A. Stauffer, and M. A metal-oriented Bowman, S. Duvall, and J. Impact of die-to-die 19 3 —, Veendrick, D. Harberts, and distribution for gigascale integration. An efficient and flexible architecture for high-density gate Circuits, 37 2 —, Samaan, and N.

Maximum clock [33] David S. Moore and George P. Introduction to the Practice of frequency distribution model with practical VLSI design considerations. In Integrated Circuit Design and Technology, Inter- [34] Sunil R. Shenoy and Akhilesh Daniel. Intel Architecture and Silicon national Conference on, pages —, Cadence: The Catalyst for Industry Innovation. Torres and C. Integrated circuit DFM framework for [14] K. Bernstein, D. Frank, A. Gattiker, and B. Haensch, S.

Liebmann, editor, Design Nassif, E. Nowak, D. Pearson, and N. IBM Journal of , pages 39— SPIE, Research and Development, —, Agarwal, V. Zolotov, and D. Statistical clock skew analysis considering intradie-process variations. Gupta and A. Manufacturing-aware physical design. Bhunia, Jung Hwan Choi, S. Mukhopadhyay, and K. Speed binning aware design methodology to improve profit under parameter variations. Capodlieci, P. Gulpta, A. Kahng, D. Sylvester, and J.

Toward a methodology for manufacturability-driven design rule exploration. In Proceedings of 41st Design Automation Conference, pages —, Pileggi, H. Schmit, A. Strojwas, P. Gopalakrishnan, V. Kheterpal, A. Koorapaty, C. Patel, V. Rovner, and K. Exploring regular fabrics to optimize the performance-cost trade-off.

In Proceedings of Design Automation Conference, pages —, Simul- taneous buffer insertion and wire sizing considering systematic CMP variation and random Leff variation. A delayed nm surprise. Electronics Design Chain Magazine, A process-tolerant cache architecture for improved yield in nanoscale technologies.

Fast, cheap and under control: the next implementation fabric. ACM Press. Design considerations for regular fabrics. Structured ASICs: opportunities and challenges. Kheterpal, V. Rovner, T. Hersan, D. Motiani, Y. Takegawa, A. Strojwas, and L. The final full Figure 3. Jitter as a function of the DLL size for noise and mismatch. VCTA design designs is described. In section III the differences between VCTA layouts are based on the repetition of a single basic the layout implementations are explained.

In section IV the cell to maximize regularity at transistor level but also for results of the electrical simulations performed are shown. In interconnects in order to maximize the benefits of regularity. Finally in section VI the synthesized and are the only source of layout irregularity of conclusions are provided. Scaling down of technology is not costly because only the VCTA basic cell has to be redesigned.

Here, the number of transistors of the array Fig. The delay line is composed of a chain of uses two metal levels, metal 1 and metal 2, forming a regular identical cells connected in series. The delay cells are based routing grid. Polysilicon to metal 1 contacts are used to on a current starved inverter where its delay is controlled by configure the transistors gate inputs and metal 1 to metal 2 means of an external voltage, and a level shifter to convert vias to configure the basic cell inputs and outputs.

Note that to the output back to rail-to-rail. The delay cell, and hence further improve regularity, two dummy transistors are added. For the comparison of VCTA and full custom designs Careful design of these delay cells is needed to reduce to be fair, the operation range of the DLL of both designs need the total energy consumption but also to reduce the jitter, to be equivalent.

Ensuring that, one design can be replaced which is mainly related to the cell mismatch Fig. Other with the other maintaining the same functionality. It is made with 4 VCTA cells. Each basic cell has mismatch [6]. Therefore regular layout techniques are suitable an array of 6 NMOS and 6 PMOS transistors sized to a for this structure based on the repetition of identical cells. In fact, analyzing just one the of the delay cells of the line and visually VCTA layout has higher regularity.

However, for the full custom dummy Poly design no clear peaks of repetition can be observed. As explained in section II, the characteristics of a delay cell are sufficient to determine the c behavior of the whole DLL. PVT variation simulations are Figure 4. Differential pair design. For this reason schematic c VCTA layout. NMOS corner model and best case parasitics at K. To analyze the behavior of the delay cell, simulations for C.

Layout Evaluation its delay, energy consumption and jitter where carried while sweeping the control voltage along its range. Note that at schematic level, VCTA has delay overhead dependence as close as possible to the original full custom when compared to full custom design because of dummy and cell. The simulation results after extraction and tiling for both spare transistors included in the VCTA cell. However, applying designs are shown in Fig.

Indeed this small difference can be 2 Regularity: From the layout designers point of view, the compensated by means of the control voltage. This is due to the parasitics introduced by the considering the energy, delay and area trade-offs.

To the best of regular metal grid, but also due to the regularity requirements the authors knowledge, the only method that has already been and redundancy. Indeed, all possible configurations of devices used to evaluate layout regularity is the visual comparison of a and interconnects are in place in a VCTA cell. Moreover, the two-dimensional Fourier transform, which performs a spatial VCTA cell also includes dummy transistors, spare transistors frequency analysis of the layout.

This analysis is then used to and spare interconnects which increase the total energy con- find out the layout patterns repetition degree [8]. Cell layout before tiling a Full Custom Two dimensional normalized FFT of the layout for: VCTA a polysilicon b metal 1 and for full custom c polysilicon d metal 1 For mobile applications, where this energy consumption is critical, VCTA offers the possibility of easily scaling down W Full custom or the process technology.

Thus, an scaling factor of 0. Regarding the full custom design, a scaling down the layout is very costly as it involves the redesign of the whole layout patterns and so it will be very Full custom time consuming. Jitter due 0. Furthermore, as regularity is known to b reduce process variations [9], the mismatch between delay 30 cells is reduced and hence the total jitter is improved.

The delay range to compensate for 0. Yield factors for different process technologies. Yield predictions for full custom and VCTA approaches. For this factor, our VCTA regular designs are For this particular DLL design, the full custom design took expected to perform much better than full custom. In fact, by roughly 6 months while the VCTA just took 1 week.

In this case, due to the higher solution. In any case, it is the less important contributor to yield loss and it is not expected to A. Every two years a technology node starts at the first small Considering the hypothesis presented above, we have assumed circuit or transistor fabrication [11].

Then, huge investments that VCTA designs will have a little advantage in front of are required in order to reach commercial chips yield. For deep full custom designs in terms of yield. We also analyze the yield improvement rate over time. The In the first year the major part of the yield improvement difference in speed between VCTA and full custom yield evo- takes place, then the improvement slows down every year.

In the case of contacts and vias of the cell, that includes transistors and VCTA, we expect that this behavior can be compressed to one interconnects, are configured depending on the function to be year. The yield improvement over time is accelerated Regarding the initial yield increase of our VCTA pro- because only a single cell layout with a reduced number of posal, we have to examine the different factors causing layout patterns has to be optimized.

That is why we have yield loss. On one hand, defect-density related problems by a given factor. Note that such ratio depends strongly on the are caused by actual errors with the silicon, such as when a process technology and the manufacturer so it may vary a lot contaminating particle is introduced during fabrication.

Most across different technologies and manufacturers. We have set of the lithography based failures occur when there are defects such factor to 1. Parametric yield loss, on of our VCTA design on yield.

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